CMP, often known as thermal oxidation sharpening, utilizes MP along with chemical substances to boost the MRR and boost surface high quality [20]. Determine two illustrates the schematic of an average CMP process [21]. The SiC wafer, which can be mounted within the provider, along with the polishing pad shift https://www.facebook.com/permalink.php?story_fbid=pfbid02qthudRtZbHesNN5ubc2ZvveB5AS9uQQyNHtgMwBU4hyNSi6jnKY3eV3o9ZT7JDQfl&id=61562415773754&__cft__[0]=AZWX_y3NrRP_jj78VzUBAV51pRwlJRQnJK3erzKMx0CLRNzLRDJlMCul2hrlBOXx7sl0vHum3DLOaOb9qMr6dxaDCIdWeCf9zol2iCs_C7tdO_eOZAiXvR5i3_kQlUCyxso0_T4jt4AmyxBMYzSAtSm-arkTy_Ph5urn_ChJ8kdA1gTXAYN8-BSLMSB1L-aacihdE4SxPPiNWg0tXt0G6l7p&__tn__=%2CO%2CP-R